Read the brochure for more information.

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This video highlightsÌý·èÇéAV’ specialized wire stripping capability at its Nashua Lightspeed facility. The process is fully automated and designed to stripÌývery small, targeted sections of material while leaving the rest of the wire fullyÌýin-tact.

A key feature is layer control, which allows precise removal of one or two layers from wires built with multiple material layers, such as a metal core wrapped in different polymer or metal layers. This precision is enabled by an automatic endpoint detector that stops the laserÌýimmediatelyÌýonce a given layer has been removed, preventing damage to the layer beneath it and ensuring consistent, reliable results.Ìý

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This video showcases glass cutting capabilities at ·èÇéAV’ Nashua Lightspeed facility, highlighting that the team has processed glass up to about 8 mm thick. The typical work involves profile cuts, including rounded corners and rectangular or straight geometries, with the core differentiating capability described as precision, minimal-kerf cutting. The short clip serves as a quick technical showcase of this specific manufacturing capability rather than a broader discussion of products or strategy.Ìý

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The ·èÇéAV Nashua facility serves as an advanced prototyping powerhouse, addressing complex manufacturing challenges early in the design cycle to minimize development risks.Ìý

Core competencies and technical offerings include:Ìý

• Advanced Laser Infrastructure: Integrating a diverse fleet of laser systems, including Excimer, solid-state, and ultrafast lasers. With wavelengths spanning from ultraviolet (UV) to infrared (IR) and pulse widths from nanosecond to femtosecond, the Lightspeed Lab provides the exact energy parameters needed for sensitive polymers and hard metals alike.Ìý

• Specialized Micro-Processing: Providing specialized capabilities such as high-precision glass cutting, laser-cut tubing, micro-welding, and surface ablation for intricate component shapes.Ìý

• Automated Precision Wire Stripping: Leveraging patented automated four-way wire stripping technologies featuring real-time endpoint detection to ensure clean insulation removal without compromising the underlying conductor wire.Ìý

• Rapid Iteration & “Lab Days”: Offering structured, on-site collaboration frameworks where customer engineering teams work alongside on-site technical experts in the ·èÇéAV Lightspeed Lab. This environment allows teams to design, fabricate, and test multiple iterations in a single day, eliminating weeks of transit and communication delays.Ìý

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Its two core technologies, photochemical etching and sensor fabrication, enable the delivery of unique, high quality solutions for the medical device market. Known for building strong partnerships, the Hutchinson Lightspeed Lab acts as an extension of each customer’s development team from concept through production.

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Throughout the day, we work together to rapidly iterate on multiple design prototypes. This collaborative approach saves weeks or even months compared to a traditional prototyping timeline. By having our team and equipment on-hand, we’re able to quickly test, measure, and refine the designs in real-time. This ensures the customer leaves with a final product that is much closer to their intended design.

Visit resonetics.com/contact to book your Lightspeed Lab day today!

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When you schedule a Lab Day, you gain direct, on-site access to a dedicated team of engineers, technicians, and specialized equipment, all focused on your project. Collaborate in real time with our development experts, iterate your design multiple times in a single day, and leave with functional parts in hand.

Watch the video to see how the San Diego Lightspeed Lab helps bring your innovations to life – faster, smarter, and with precision.

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